Professor of Materials Science and Engineering
Siu-Wai Chan studies size-dependent properties of nano-ceramics and crystalline interfaces.
Chan’s research has focused on nano-ceramics and crystalline interfaces. Many working devices such as varistors and CMOS-FET's use novel electrical transport properties of grain boundaries and interfaces, respectively.
A part of Chan’s research studies the size-dependent mechanical properties of nano-ceramics which yields a fundamental understanding of ceramics in general. Another part identifies interfaces and boundaries that have exceptional electronic and electrical responses in order to exploit their uses in devices.
While many size-dependent electronic and optical properties of nanoparticles have been thoroughly studied, basic properties such as compressibility and bond lengths have been neglected. Recently, we have used the diamond anvil cell to study the “bulk modulus” as a function of the size of nano-oxides and have found a trend that needs to be addressed fundamentally. Bulk modulus and bond lengths are some of the fundamental properties. Understanding the size-dependent trend will help us to better understand materials in general.
Chan received a BS in materials science and metallurgy and the Francis B.F. Rhodes Prize from Columbia Engineering. Chan earned a ScD in materials science and metallurgy from Massachusetts Institute of Technology. After being a staff member of Bell-Labs in NJ, Chan came back to Alma Mater as an associate professor and became co-chair of the Solid State Program in 2001. Chan lectured and conducted research at Nanyang Technological University in Singapore under the Tan Fellowship, at University of Washington as an Advance Fellow, and at University of California, San Diego, as a Guggenheim Fellow. Chan received Presidential Faculty Fellow from President Bill Clinton and faculty research award from IBM, DuPont, and BASF. Chan was a visiting scientist at the IBM Watson Research Lab, NIST Boulder CO, and Bitter Magnet Lab, MA. She is the holder of six U.S. patents.